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BCM® Bus Converter Module

Bus converters

Bus Converters are high-density, high-efficiency, fixed ratio (non-regulating) isolated DC-DC converter modules. BCMs are available in ChiP or a Vicor Integrated Adapter (VIA) package which simplifies cooling as well as providing integrated PMBus control, EMI filtering, and transient protection. The family extends from 800V to 48V inputs with various K factors to suit a wide range of applications and markets. Based on our proprietary Sine-Amplitude Converter topology, high voltage BCM ChiPs are able to reach peak efficiencies of 98% and achieve power densities up to 2,400W/in³. These flexible modules can be easily paralleled into high power arrays and outputs can be put in series to achieve a higher VOUT. BCMs are inherently bidirectional and also allow designers to reduce the amount of bulk capacitance needed at the load by effectively ‘reflecting’ the capacitance across the module based on the specified K factor.  

MIL-COTS versions are also available and operate from MIL-STD-704E/F 270V and deliver an isolated 25.0 – 50.0V, 30.0 – 41.25V, or 38.3 - 55.0V output. 

Vicor fixed-ratio bus converters are powering many of today’s world changing innovations in electric planes, maritime communication UAVs, and risky underwater ROV explorations.
 

Features and Benefits

Features and benefits

High efficiency of up to 98%

High power density

High power density of up to 2,735W/in3

Parallel capability for higher power arrays

Parallel capability for higher power arrays

Thermally-adept VIA housing

Thermally-adept VIA housing

Select a BCM

0 Products
Image Input (V) Output (V) Output Current (A) Package Control Interface Add to cart / view details
Input (V):
36 - 60
Output (V):
6 - 10
Output Current (A):
150.0
Package:
3814 VIA
Control Interface:
Digital
Details
Input (V):
36 - 60
Output (V):
6 - 10
Output Current (A):
150.0
Package:
6123 ChiP
Control Interface:
Analog
Details
Input (V):
36 - 60
Output (V):
6 - 10
Output Current (A):
150.0
Package:
6123 ChiP
Control Interface:
Digital
Details
Input (V):
36 - 60
Output (V):
9 - 15
Output Current (A):
130.0
Package:
3814 VIA
Control Interface:
Digital
Details
Input (V):
36 - 60
Output (V):
9 - 15
Output Current (A):
130.0
Package:
6123 ChiP
Control Interface:
Digital
Details
Input (V):
36 - 60
Output (V):
9 - 15
Output Current (A):
130.0
Package:
6123 ChiP
Control Interface:
Analog
Details
Input (V):
260 - 410
Output (V):
8.1 - 12.8
Output Current (A):
125.0
Package:
4414 VIA
Control Interface:
Digital
Details
Input (V):
260 - 410
Output (V):
8.1 - 12.8
Output Current (A):
125.0
Package:
6123 ChiP
Control Interface:
Analog
Details
Input (V):
260 - 410
Output (V):
8.1 - 12.8
Output Current (A):
125.0
Package:
6123 ChiP
Control Interface:
Digital
Details
Input (V):
260 - 410
Output (V):
8.1 - 12.8
Output Current (A):
125.0
Package:
6123 ChiP
Control Interface:
Reverse Analog
Details
Input (V):
38 - 55
Output (V):
2.4 - 3.4
Output Current (A):
80.0
Package:
Full Chip
Control Interface:
Analog
Details
Input (V):
260 - 410
Output (V):
8.1 - 12.8
Output Current (A):
68.0
Package:
6123 ChiP
Control Interface:
Analog
Details
Input (V):
260 - 410
Output (V):
8.1 - 12.8
Output Current (A):
68.0
Package:
6123 ChiP
Control Interface:
Digital
Details
Input (V):
260 - 410
Output (V):
8.1 - 12.8
Output Current (A):
68.0
Package:
6123 ChiP
Control Interface:
Reverse Analog
Details
Input (V):
260 - 410
Output (V):
16.3 - 25.6
Output Current (A):
62.5
Package:
4414 VIA
Control Interface:
Digital
Details
Input (V):
260 - 410
Output (V):
16.3 - 25.6
Output Current (A):
62.5
Package:
6123 ChiP
Control Interface:
Analog
Details
Input (V):
260 - 410
Output (V):
16.3 - 25.6
Output Current (A):
62.5
Package:
6123 ChiP
Control Interface:
Reverse Analog
Details
Input (V):
260 - 410
Output (V):
16.3 - 25.6
Output Current (A):
62.5
Package:
6123 ChiP
Control Interface:
Digital
Details
Input (V):
38 - 55
Output (V):
3.2 - 4.6
Output Current (A):
53.0
Package:
Full Chip
Control Interface:
Analog
Details
Input (V):
38 - 55
Output (V):
4.8 - 6.9
Output Current (A):
47.0
Package:
Full Chip
Control Interface:
Analog
Details
Input (V):
400 - 700
Output (V):
25 - 43.7
Output Current (A):
40.0
Package:
4414 VIA
Control Interface:
Digital
Details
Input (V):
38 - 55
Output (V):
6.3 - 9.2
Output Current (A):
36.0
Package:
Full Chip
Control Interface:
Analog
Details
Input (V):
260 - 410
Output (V):
32.5 - 51.3
Output Current (A):
35.0
Package:
4414 VIA
Control Interface:
Digital
Details
Input (V):
260 - 410
Output (V):
32.5 - 51.2
Output Current (A):
35.0
Package:
6123 ChiP
Control Interface:
Analog
Details
Input (V):
260 - 410
Output (V):
32.5 - 51.2
Output Current (A):
35.0
Package:
6123 ChiP
Control Interface:
Digital
Details
Input (V):
260 - 410
Output (V):
32.5 - 51.2
Output Current (A):
35.0
Package:
6123 ChiP
Control Interface:
Reverse Analog
Details
Input (V):
260 - 410
Output (V):
32.5 - 51.2
Output Current (A):
35.0
Package:
6123 ChiP
Control Interface:
Reverse Digital
Details
Input (V):
500 - 800
Output (V):
31.2 - 50
Output Current (A):
35.0
Package:
4414 VIA
Control Interface:
Digital
Details
Input (V):
200 - 400
Output (V):
25 - 50
Output Current (A):
30.0
Package:
6123 ChiP
Control Interface:
Reverse Digital
Details
Input (V):
200 - 400
Output (V):
25 - 50
Output Current (A):
30.0
Package:
6123 ChiP
Control Interface:
Analog
Details
Input (V):
200 - 400
Output (V):
25 - 50
Output Current (A):
30.0
Package:
6123 ChiP
Control Interface:
Reverse Analog
Details
Input (V):
38 - 55
Output (V):
9.5 - 13.8
Output Current (A):
30.0
Package:
Full Chip
Control Interface:
Analog
Details
Input (V):
330 - 365
Output (V):
10.3 - 11.4
Output Current (A):
28.5
Package:
Full Chip
Control Interface:
Analog
Details
Input (V):
330 - 365
Output (V):
10.3 - 11.4
Output Current (A):
28.5
Package:
Full Chip
Control Interface:
Analog
Details
Input (V):
360 - 400
Output (V):
11.2 - 12.5
Output Current (A):
27.3
Package:
Full Chip
Control Interface:
Analog
Details
Input (V):
330 - 365
Output (V):
11.8 - 13
Output Current (A):
26.0
Package:
Full Chip
Control Interface:
Analog
Details
Input (V):
260 - 410
Output (V):
32.5 - 51.2
Output Current (A):
25.7
Package:
6123 ChiP
Control Interface:
Analog
Details
Input (V):
260 - 410
Output (V):
32.5 - 51.2
Output Current (A):
25.7
Package:
6123 ChiP
Control Interface:
Digital
Details
Input (V):
260 - 410
Output (V):
32.5 - 51.2
Output Current (A):
25.7
Package:
6123 ChiP
Control Interface:
Reverse Analog
Details
Input (V):
38 - 55
Output (V):
7.6 - 11
Output Current (A):
25.0
Package:
Full Chip
Control Interface:
Analog
Details
Input (V):
260 - 410
Output (V):
32.5 - 51.2
Output Current (A):
16.9
Package:
6123 ChiP
Control Interface:
Analog
Details
Input (V):
260 - 410
Output (V):
32.5 - 51.2
Output Current (A):
16.9
Package:
6123 ChiP
Control Interface:
Digital
Details
Input (V):
260 - 410
Output (V):
32.5 - 51.2
Output Current (A):
16.9
Package:
6123 ChiP
Control Interface:
Reverse Analog
Details
Input (V):
38 - 55
Output (V):
12.7 - 18.3
Output Current (A):
15.0
Package:
Full Chip
Control Interface:
Analog
Details
Input (V):
38 - 55
Output (V):
19 - 27.5
Output Current (A):
12.5
Package:
Full Chip
Control Interface:
Analog
Details
Input (V):
38 - 55
Output (V):
9.5 - 13.8
Output Current (A):
10.0
Package:
Half Chip
Control Interface:
Analog
Details
Input (V):
38 - 55
Output (V):
25.3 - 36.7
Output Current (A):
9.4
Package:
Full Chip
Control Interface:
Analog
Details
Input (V):
330 - 365
Output (V):
41.3 - 45.6
Output Current (A):
7.7
Package:
Full Chip
Control Interface:
Analog
Details
Input (V):
360 - 400
Output (V):
45 - 50
Output Current (A):
7.05
Package:
Full Chip
Control Interface:
Analog
Details
Input (V):
240 - 330
Output (V):
30 - 41.2
Output Current (A):
7.3
Package:
Full Chip
Control Interface:
Analog
Details
Input (V):
38 - 55
Output (V):
38 - 55
Output Current (A):
6.25
Package:
Full Chip
Control Interface:
Analog
Details
Input (V):
200 - 330
Output (V):
33.4 - 55.1
Output Current (A):
6.25
Package:
Full Chip
Control Interface:
Analog
Details
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Resources

Resources for the design engineer

Reliable operation in a tough environment for ore prospecting instrumentation case study
Case Study

Reliable operation in a tough environment for ore prospecting instrumentation

DC-DC transformer facilitates implementation of longer tether for underwater ROV case study
Case Study

DC-DC transformer facilitates implementation of longer tether for underwater ROV

  • AN:001 – Configuring the Vicor BCM with Low Power niPOLs
  • AN:009 – SMT J-Lead VI Chip Soldering Recommendations
  • AN:016 – Using BCM™ Bus Converters in High Power Arrays
  • AN:017 – RoHS Compliant Through-Hole VI Chip Soldering Recommendations
  • AN:031 – Through-Hole ChiP Package Soldering Guidelines
  • AN:034 – Creating Higher Voltage Outputs using Series Connected Sine Amplitude Converters
  • AN:036 – Recommendations for Maximum Compressive Force of Heat Sinks
  • AN:038 – HV ChiP BCM® Reverse Start Up Circuit
  • AN:039 – Thermal Management for VIA and ChiP Modules
  • AN:401 – PCB Mount VIA Soldering Guidelines

  • UG:010 – VI Chip High Voltage BCM Evaluation Board User Guide
  • UG:015 – Analog Low Voltage/High Voltage 6123 ChiP BCM Bus Converter Evaluation Board User Guide
  • UG:018 – PMBus 2361 and 6123 ChiP BCM Bus Converter Evaluation Board User Guide
  • Graphic user interface (GUI) to access PMBus(TM) interface
  • UG:901 – PMBus Interface and Accessories User Guide (Current)

  • Instrumentation for ore prospecting allows reliable operation in a tough environment
  • DC-DC transformer facilitates implementation of longer underwater tether
  • High density power allows for unobtrusive, 5G indoor small-cell base station
  • Additional electronics for passenger seat actuators are solved with smaller, lighter components
  • Enormous video wall display becomes feasible with a move to component-enabled, higher voltage bus
  • 5kW tethered UAVs fly higher and longer using increased voltage on the tether
  • Bidirectional DC-DC converters conveniently transfer power between the grid and batteries in home energy storage
  • High voltage bus converters significantly reduce installation costs for outdoor stadium lighting
  • High power supply efficiency provides reliable power over ethernet
  • Scalable, low-weight DC-DC solution for high-capacitive loads in airborne radar

Full-Chip Half-Chip Full-Chip High Voltage 6123, 2361 High Voltage 4414 VIA High Voltage / Ultra High Voltage 3814 VIA Low Voltage 6123, 2361 Low Voltage

  • Full Chip J-lead Product Outline Drawing
    PDF DXF
  • Full Chip Through-Hole Product Outline Drawing
    PDF DXF
  • 6123 ChiP Through-Hole Product Outline Drawing
    PDF DXF
  • 6123 ChiP High Current Package (Pins on the long side)Through-Hole Product Outline Drawing
    PDF DXF
  • 3814 VIA Package Chassis Mount Outline Drawing
    PDF DXF
  • 3814 VIA Package Board Mount Outline Drawing
    PDF DXF
  • 4414 VIA Package Chassis Mount Outline Drawing
    PDF DXF
  • 4414 VIA Package Board Mount Outline Drawing
    PDF DXF

  • Full Chip J-lead Product 3-D Model Drawing
    IGS STP
  • Full Chip Through-Hole 3-D Model Drawing
    IGS STP
  • 6123 ChiP Through-Hole Product 3-D Model Drawing
    IGS STP
  • 6123 ChiP High Current (Pins on the long side)Through-Hole Product 3-D Model Drawing
    IGS STP
  • 3814 VIA Chassis Mount 3-D Model Drawing
    IGS STP
  • 3814 VIA Board Mount Short Pin 3-D Model Drawing
    IGS STP
  • 3814 VIA Board Mount Long Pin 3-D Model Drawing
    IGS STP
  • 4414 VIA Chassis Mount 3-D Model Drawing
    IGS STP
  • 4414 VIA Board Mount Short Pins with communication 3-D Model Drawing
    IGS STP
  • 4414 VIA Board Mount Long Pins with communication 3-D Model Drawing
    IGS STP
  • 4414 VIA Chassis Mount High Current 3-D Model Drawing
    IGS STP
  • 4414 VIA Board Mount Short Pins High Current 3-D Model Drawing
    IGS STP
  • 4414 VIA Board Mount Long Pins High Current 3-D Model Drawing
    IGS STP

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